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Home > Product > Product Details
Production & Inspection > Wafer Production Equipment > Polishing & Grinding
  Multi-axis Grinding and Polishing Equipment
Model No CB-210
Company Name naewaicommercial
Country South Korea
Detailed Product Description
ㆍA single unit covers both the input & output of work pieces, and the grinding & polishing with high efficiency and great precision.
ㆍGrinding device for squarely cut silicon ingot
ㆍ6 spindles and 3 axis of finishing levels on both sides realize high precision plane grinding in a single operation, therefore highly efficient.
ㆍGrinding of an R-plane, C-plane, and a level surface is available without grindstone exchanges.
ㆍLoading, processing, work rotation, and sending of works are automated by using a work stocker, therefore unmanned low-cost operation is available.
ㆍAuto centering system measures the height of each work with a sensor, and performs centering by up & down movement of the work receiving block.

Flute 2 Axis Proce...
Periphery Grinding...

Company Name naewaicommercial [Worldwide (Main Market)]
Business Type Distributor/Wholesaler, Agent
Contact Person Kwang-Hong Kim
Address #1208 Kwangbyun Hanshin Core Bldg., 350 Mapo-Dong, Mapo-Gu, , Seoul, South Korea
Zip 121-703
Phone 82-2-701 1192
Fax 82-2-701 1194
Website http://www. hara-mc.co.jp/english/

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