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Production & Inspection >> Wafer Production Equipment >> Polishing & Grinding
Flute 2 Axis Processing Machine(Flexible-blad...    
ㆍA single unit covers both the input & output of work pieces, and corner cutting with high efficiencyㆍCutting monocrystalline silicon or a grinded cylinder of silicon ingot to quadrangular prism.ㆍCutting 2 planes at once with double blades.ㆍLoading, processing, work rotation, and sending of works are automated by using a work stocker, therefore unm...
Multi-axis Grinding and Polishing Equipment    
ㆍA single unit covers both the input & output of work pieces, and the grinding & polishing with high efficiency and great precision.ㆍGrinding device for squarely cut silicon ingotㆍ6 spindles and 3 axis of finishing levels on both sides realize high precision plane grinding in a single operation, therefore highly efficient.ㆍGrinding of an R-plane, C...
Periphery Grinding Equipment    
ㆍFast and high precision processing of polycrystalline silicon or pulled out mono crystalline silicon periphery.ㆍThis machine enables high-speed, high-accuracy cylindrical grinding and provides automatic centering function. It auto-measures abrasion wear and automatically corrects depth of cut. This is a high-grade machine with integrated know-how ...
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